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Micro-Fluidic Cooling System for High-Density Server Processor Arrays

Patent #US12008902B2

Public record:Verify on Google Patents

An active cooling solution incorporating micro-channels for direct liquid immersion cooling on high-power processing units. The system significantly reduces thermal throttling in large-scale data centers.

Issue Date

5/12/2026

Inventor

Kevin J. O'Malley

Seller Location

United States

Price on request

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