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Thermal Management Heat Sink Integrated with Phase-Change Materials for Portable Electronics

Patent #US12854210B2

Public record:Verify on Google Patents

A compact cooling module utilizing encapsulated phase-change materials to absorb rapid heat spikes in smartphones and tablets. This device maintains peak processing speed without requiring active cooling fans.

Issue Date

5/3/2026

Inventor

Samuel T. O'Reilly

Seller Location

United States

Price on request

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